Thin film filter
In Stock 30
Bandwidth32.0-36.2GHz, Rejection40@DC-29.8GHz, 40@38.2-48.0GHz
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Delivery Time ： 1-3 Day(WorkDay)
Terms: Ex Work from Chengdu warehouse, minimum order amount US$200. The product is produced by COM-MW Technology Co.,Ltd and sold by Sichuan Dianzibuy Technology Co.,Ltd
MOQ : 1
Attention: The online trading belongs to commercial activities, the final transaction price might be lower than tag price, subject to automatically system calculating; The price is competitive, product fully tested and qualified, we will offer certificate of conformity, no test report.
- Contact Us
- Cynthia
- cynthia@com-mw.com
sales@com-mw.com
+86 19938031308- 23 floor, No. 1 building, P Jiuxi Plaza, No.37, Jiancai Road, Chenghua Zone, Chengdu
Product features
High precision machining technology
Low temperature drift, high power.
Ceramic substrate, 50 Ω coplanar waveguide
Gold wire bonding
Tech specifications
| Items | Parameters | Units |
| Center Frequency | 34.1 | GHz |
| Bandwidth | 32.0-36.2 | GHz |
| Center loss | 2.6 | dB |
| Ripple | 1.0 | dB |
| VSWR | 1.7:1 | |
| Group delay ripple | 0.4 | ns |
| Rejection | 40@DC-29.8GHz | dBc |
| Rejection | 40@38.2-48.0GHz | dBc |
Other requirement (Design assurance)
| power | 2W CW |
| Work Temp. | -55~+85℃ |
| Storage Temp. | -55~+125℃ |
| Outline size | L:9.0，W:2.5，h:0.26 |
Outline drawing: Port centered
Suggested PCB Layout
Note
1: 0.1mm from the side wall, 2.75mm from the surface to the upper cover.
2: Suggest using conductive adhesive for bonding;
3: The chip should be installed on kovar alloy or molybdenum copper;
4: Suggest using a T-shaped structure for microstrip bonding.
Schematic diagram
Typical test curve
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